Mounting pad and semiconductor encapsulation device combination

Details Mounting pad and semiconductor encapsulation device combination Mounting pad and semiconductor encapsulation device combination

1974-12-05

1976-06-08

Askin, Laramie E.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

29203R, 174138G, H01L 2312

Patent

active

039627195

ABSTRACT:
Disclosed is a semiconductor mounting pad employing slots into which the leads projecting from a header may be inserted without passing the entire lead through the pad. Apparatus for assembling the mounting pads on standard enclosure devices is also disclosed.

REFERENCES:
patent: 109580 (1870-11-01), Bradley et al.
patent: 422651 (1890-03-01), Stanley
patent: 1639310 (1927-08-01), Richardson
Catalogue published by Bivar, Inc., 1500 South Lyon Street, Santa Anna, Calif., copyright 1969, p. 4-1 and p. 5-2b.
Jones, IBM Technical Disclosure Bulletin, "Transistor Spacer," vol. 8, No. 9, Feb. 1966, p. 1298.

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