Multichip thin film module

Details Multichip thin film module Multichip thin film module

1985-02-05

1987-10-06

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 16HS, 357 81, H01L 3902, H01L 2302

Patent

active

046986626

ABSTRACT:
A package for thermal dissipation of heat from multiple integrated circuit chips is described. The package includes a silicon substrate for electrical connection to silicon integrated-circuit chips. The silicon substrate provides a high degree of thermal dissipation of heat generated by the chips. In addition, the invention comprehends that the silicon substrate is attached to a heat dissipating means. In the preferred embodiment, the heat dissipating means includes a metal heat sink. The package is capable of dissipating up to six watts per square centimeter of heat from the chips.

REFERENCES:
patent: 4027206 (1977-05-01), Lee
patent: 4092614 (1978-05-01), Sakuma et al.
patent: 4361717 (1982-11-01), Gilmore et al.
patent: 4450471 (1984-05-01), Wellhoefer et al.
patent: 4546478 (1985-10-01), Shimizu et al.
patent: 4604753 (1986-06-01), Sawai
Spielberger et al., "Silicon-on-Silicon Packaging", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-7, No. 2 (1984) pp. 193-196.
Satoh et al., "A High Speed Multi-Chip Ram Module with Thermal Stress Free Configuration", Proceedings of the International Conference on Computer Design, Oct. 1984, pp. 569-572.
"GigaBit Develops Silicon Packaging", Electronic News, 11-12-84.

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