Multilayer ceramic package with high frequency connections

Details Multilayer ceramic package with high frequency connections Multilayer ceramic package with high frequency connections

1987-10-02

1990-05-01

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 174266, 372 36, H01L 2302, H01L 2312

Patent

active

049223259

ABSTRACT:
A multilayer ceramic package is disclosed which includes a high frequency interconnect that simulates the performance of a conventional coaxial connector. The interconnect comprises a signal conductor surrounded by the ceramic material forming the package. A plurality of vias are formed through the ceramic material so as to surround the conductor. These vias are then connected to a ground plane to form the outer shielding for the high frequency interconnect.

REFERENCES:
patent: 4309717 (1982-01-01), Cardinal
patent: 4417392 (1983-11-01), Ibrahim
patent: 4430365 (1984-02-01), Schaible et al.
patent: 4577214 (1986-03-01), Schaper
patent: 4649417 (1987-03-01), Burgess et al.
patent: 4667220 (1987-05-01), Lee et al.
patent: 4713634 (1987-12-01), Yamamura
patent: 4725878 (1988-02-01), Miyauchi et al.
patent: 4809058 (1989-02-01), Funamoto et al.
patent: 4811082 (1989-03-01), Jacobs et al.

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