4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
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Built-in stress pattern on IC dies and method of forming

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Bump pattern design for flip chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Bumped chip carrier package using lead frame and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Bus bar structure on lead frame of semiconductor device package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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