Bumped chip carrier package using lead frame and method for...

Details Bumped chip carrier package using lead frame and method for... Bumped chip carrier package using lead frame and method for...

2006-01-10

2006-01-10

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C438S106000, C438S107000, C438S118000, C438S121000, C438S128000, C029S830000, C029S846000, C257SE21508, C257SE23031, C257SE23046, C257SE23124

Reexamination Certificate

active

06984877

ABSTRACT:
A semiconductor package such as a bumped chip carrier (BCC) package has projections extending from a lower surface of a resin encapsulant. Each projection has a concave depression formed thereon. By reflowing a solder layer, external terminals are formed to cover the projections. An interface between the terminals and the projections increases in area, relative to conventional structures, because of the concave depressions. Therefore, the adhesive strength between the terminals and the projections also increases, and, when the BCC package is mounted on a next-level circuit board through the terminals, solder joint is also improved in reliability.

REFERENCES:
patent: 6573121 (2003-06-01), Yoneda et al.
patent: 2003/0015780 (2003-01-01), Kang et al.
patent: 2003/0138992 (2003-07-01), Rokugawa et al.
patent: 1020010001160 (2001-01-01), None
patent: 2002-31881 (2002-05-01), None
patent: 1020030008616 (2003-01-01), None
English language abstract of Korean Publication No. 1020010001160.
English language abstract of Korean Publication No. 1020030008616.
English language abstract of Korean Publication No. 2002-31881.

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