LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame,With stress relief

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Stress shield for microelectronic dice

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Stress shield for microelectronic dice

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Stress-free lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Stress-free lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Stress-free semiconductor leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Substrate assembly for stressed systems

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Substrate for accepting wire bonded or flip-chip components

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Surface mount device with compensation for thermal expansion eff

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Tape automated bonding(tab)semiconductor device and method for m

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Tape carrier package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Tapered isolated metal profile to reduce dielectric layer cracki

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

TSOP type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Underfill coating for LOC package