Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1997-04-10
1998-08-18
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257706, 257720, 257796, 361717, 361723, H01L 2310, H01L 2334
Patent
active
057961603
ABSTRACT:
The present invention is provided with a transfer-mold package wherein the surface of a heat sink on which a semiconductor chip dissipating a large amount of heat is formed (the surface does not contact the chip) is exposed from the sealing resin. In this package, a concave portion 16a is formed in the surface of the heat sink to a depth of about 0.1 mm within a range of about 1 mm from the periphery of the heat sink. The concave portion prevents the sealing resin from extending toward the surface of the heat sink at the time of transfer mold, with the result that a resin burr can be prevented from occurring on the periphery of the surface of the heat sink exposed from the sealing resin, and the flatness of the surface of the heat sink can be prevented from being degraded by the resin burr.
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Kabushiki Kaisha Toshiba
Ostrowski David
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