LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assemblies, methods of making same and compon

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assemblies, methods of making same and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with bumped conductive trace

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with bumped conductive trace

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with bumped metal pillar

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with bumped terminal and filler

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with carved bumped terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with pillar press-fit into...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with press-fit ground plane

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip assembly with welded metal pillar that...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip capable of increased number of pads in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip carrier affording a high-density external int

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip carrier including an interconnect component i

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip having a chip metal layer and a transfer meta

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip having chip metal layer and transfer metal la

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip having pads with plural junctions for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip manufacturing method, semiconductor chip,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip mounting body, method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Semiconductor chip mounting structure with movable...