Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-05-08
2007-05-08
Purvis, Sue A. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S698000, C257S785000
Reexamination Certificate
active
11478289
ABSTRACT:
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electrically connected to the pad.
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U.S. Appl. No. 10/714,794, filed Nov. 17, 2003, entitled “Semiconductor Chip Assembly with Embedded Metal Pillar”.
Bridge Semiconductor Corporation
Purvis Sue A.
Sandvik Benjamin P.
Sigmond David M.
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