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Integrated circuit packaging system with a tiered substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit power supply

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit with edge connections and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Integrated circuit with multiple layers of circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit with tightly coupled passive components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Integrated RF M×N switch matrix

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Interconnect structure for surface mounted devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Interconnection arrangement for power semiconductor switching de

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Internal capacitor arrangement for semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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