Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
1999-06-08
2001-01-30
Wong, Don (Department: 2821)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S777000
Reexamination Certificate
active
06181008
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to an integrated circuit (IC) power supply, and, more particularly, to a semiconductor integrated circuit system which includes a plurality of power supplies contained within the system which are electrically connected to different parts of the circuit within the system.
BACKGROUND OF THE INVENTION
Semiconductor integrated circuit devices are getting larger because they incorporate a number of various types of circuits on a single chip. In order to accommodate all of the various circuits on a single chip, the feature size of the various elements forming the circuit are becoming smaller. Thus, the feature size of these integrated circuits are scaling into the deep submicron range. For such sizes, the power supply voltages are reaching towards the sub-one volt level, and clock speeds are scheduled to exceed one Gigahertz. For very large integrated circuits, such as a microprocessor, the power supply current is expected to be many tens of amperes. To provide this type of power from off chip is very difficult and requires a large number of power and ground pads (ports) around the chip. Also, distributing the current on chip from the large number of power and ground pads requires many relatively wide and thick metal conductors to prevent the significant high resistance losses which could ultimately limit the device performance.
SUMMARY OF THE INVENTION
An integrated circuit device includes a substrate of an insulating material having a surface. An IC semiconductor chip is mounted on the surface of the substrate. The IC chip contains an electrical circuit having a plurality of functional blocks. A plurality of power supply chips are mounted on the substrate with the power supply chips being electrically connected to separate functional blocks of the IC chip. Each of the power supply chips is capable of reducing an input voltage to a lower voltage as required by the functional block to which the power supply chip is connected.
REFERENCES:
patent: 4742385 (1988-05-01), Kohmoto
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5608261 (1997-03-01), Bhattacharyya et al.
patent: 5790384 (1998-08-01), Ahmad et al.
patent: 5798567 (1998-08-01), Kelly et al.
Amantea Robert
Avery Leslie Ronald
Goodman Lawrence Alan
Burke William J.
Chen Shih-Chao
Sarnoff Corporation
Wong Don
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