Integrated circuit with multiple layers of circuits

Details Integrated circuit with multiple layers of circuits Integrated circuit with multiple layers of circuits

2011-01-04

2011-01-04

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S686000, C257SE23152, C257SE23169, C257SE23171, C257SE23175, C257SE21598, C438S109000, C438S129000, C438S130000

Reexamination Certificate

active

07863733

ABSTRACT:
An integrated circuit78is formed of multiple layers of circuits14, 16superimposed to produce stacks of circuit blocks2, 4. Stack control circuitry18, 20is associated with the input and output signals from the circuit blocks to direct these to/from the currently active circuit block(s) as appropriate. The superimposed circuit blocks2, 4provide redundancy for each other, both for manufacturing defect resistance and for operational redundancy, such as providing multiple modular redundancy in safety critical environments.

REFERENCES:
Lea et al., “A 3-D Stacked Chip Packaging Solution for Miniaturized Massively Parallel Processing,” (1999), 9 pgs.
Black et al., “Die Stacking (3D) Microarchitecture,” 11 pgs.

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