Integrated circuit with tightly coupled passive components

Details Integrated circuit with tightly coupled passive components Integrated circuit with tightly coupled passive components

1997-12-17

2000-04-25

Graybill, David E.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257666, H01L 23495, H01L 2334

Patent

active

060547642

ABSTRACT:
A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfaces (201) on the lower surface of each lead (203). Preferably, each lead has a plurality of third bonding surfaces (202) formed on at least some of the plurality of leads where the third bonding surfaces (202) are formed by conductive extensions of the leads (203) that extend towards the center of the assembly (100). A first passive component (102) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (104) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (202) are used, a third component (103) is electrically and mechanically coupled to the third bonding surfaces (202).

REFERENCES:
patent: 4028722 (1977-06-01), Helda
patent: 5592020 (1997-01-01), Nakao et al.
patent: 5719436 (1998-02-01), Kuhn
patent: 5767564 (1998-06-01), Kunimatsu et al.
patent: 5793108 (1998-08-01), Nakanishi et al.

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