4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant
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Package structure for semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Packaged semiconductor device incorporating heat sink plate

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Plastic ball grid array package with integral heatsink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Plastic encapsulated integrated circuit package having an embedd

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Plastic molded package with heat sink for integrated circuit dev

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Plastic molded semiconductor package and a method for producing

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Plastic molded semiconductor package with thermal dissipation me

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Plastic-packaged semiconductor device having a heat sink matched

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Plate and column type semiconductor package having heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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