Plastic molded semiconductor package with thermal dissipation me

Details Plastic molded semiconductor package with thermal dissipation me Plastic molded semiconductor package with thermal dissipation me

1996-11-14

1998-08-25

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257712, 257713, 257718, 257705, 361704, 361707, 361709, H01L 2348, H01L 2944

Patent

active

057985707

ABSTRACT:
In construction of a plastic molded semiconductor package incorporating a metallic heat sink, the heat sink is made of a thin plate but provided with a central die support depressed from the plane of a surrounding lead support, the section opposite the die support being exposed outside a plastic package. Use of a thin plate as the material enables efficient, continuous processing in production. Presence of the depressed die support assures elongated boundary between the heat sink and the plastic package, thereby effectively reducing undesirable invasion of outer contaminant.

REFERENCES:
patent: 5442234 (1995-08-01), Liang
patent: 5455462 (1995-10-01), Marrs
patent: 5486720 (1996-01-01), Kierse
patent: 5594282 (1997-01-01), Otsuki

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