Plastic molded semiconductor package and a method for producing

Details Plastic molded semiconductor package and a method for producing Plastic molded semiconductor package and a method for producing

1997-06-27

2000-02-01

Picardat, Kevin M.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257718, 257706, H01L 2348

Patent

active

060206497

ABSTRACT:
In construction of a plastic molded semiconductor package provided with a heat sink and electrically conductive leads attached to the periphery of the heat sink, a conventional electrically insulating, adhesive bonding tape is replaced by a non-adhesive insulating sheet and support bars are locally provided in a lead frame between the leads. For uniting the leads to the heat sink, the support bars are fixed to the heat sink whilst sandwiching the insulating sheet. No use of the adhesive bonding tape greatly reduces intrusion of contaminants into the package, simplifies the production process and lowers the production cost.

REFERENCES:
patent: 5387554 (1995-02-01), Liang
patent: 5455462 (1995-10-01), Marrs
patent: 5763296 (1998-06-01), Casati et al.
patent: 5770479 (1998-06-01), Brooks et al.
patent: 5798570 (1998-08-01), Watanabe et al.
patent: 5886396 (1999-03-01), Carney et al.

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