4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With heat sink embedded in encapsulant
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Molded circuit package having heat dissipating post

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Molded plastic semiconductor package including heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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