Radio frequency identification (RFID) tag lamination process...
Redistribution layer enhancement to improve reliability of...
Redistribution layer enhancement to improve reliability of...
Reduced inductance in ball grid array packages
Reduced inductance in ball grid array packages
Reduced-dimension microelectronic component assemblies with...
Reduced-dimension microelectronic component assemblies with...
Redundant wiring apparatus and a method of making the same
Release resistant electrical interconnections for MEMS devices
Removal of extended bond pads using intermetallics
Resilient contact structures, electronic interconnection...
Resin coated bonding wire, method of manufacturing the same, and
Resin-encapsulated semiconductor device
Routing design to minimize electromigration damage to solder...