Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2005-11-22
2008-11-25
Coleman, W. David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C438S119000, C343S760000
Reexamination Certificate
active
07456506
ABSTRACT:
A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
REFERENCES:
patent: 3759246 (1973-09-01), Flack et al.
patent: 5058161 (1991-10-01), Weiss
patent: 5463377 (1995-10-01), Kronberg
patent: 5598032 (1997-01-01), Fidalgo
patent: 5629981 (1997-05-01), Nerlikar
patent: 5786626 (1998-07-01), Brady et al.
patent: 5874902 (1999-02-01), Heinrich et al.
patent: 5892611 (1999-04-01), Iisuka
patent: 5942978 (1999-08-01), Shafer
patent: 5963134 (1999-10-01), Bowers et al.
patent: 6049461 (2000-04-01), Haghiri-Tehrani et al.
patent: 6089284 (2000-07-01), Kaehler et al.
patent: 6111520 (2000-08-01), Allen et al.
patent: 6130623 (2000-10-01), MacLellan et al.
patent: 6133833 (2000-10-01), Sidlauskas et al.
patent: 6147662 (2000-11-01), Grabau et al.
patent: 6204760 (2001-03-01), Brunius
patent: 6206292 (2001-03-01), Robertz et al.
patent: 6265977 (2001-07-01), Vega et al.
patent: 6400323 (2002-06-01), Yasukawa et al.
patent: 6421013 (2002-07-01), Chung
patent: 6514790 (2003-02-01), Plettner et al.
patent: 6696952 (2004-02-01), Zirbes
patent: 6774800 (2004-08-01), Friedman et al.
patent: 6849936 (2005-02-01), Berman et al.
patent: 2002/0053735 (2002-05-01), Neuhaus et al.
patent: 2002/0140608 (2002-10-01), Zaghloul et al.
patent: 2003/0116790 (2003-06-01), Kokuchi et al.
patent: 2004/0070510 (2004-04-01), Zhang et al.
patent: 2005/0128086 (2005-06-01), Brown et al.
patent: 2005/0252605 (2005-11-01), Green et al.
patent: 0 903 805 (1999-03-01), None
PCT International Search Report dated Apr. 29, 2008 in connection with Application No. PCT/US06/60922.
Coleman W. David
Fliesler & Meyer LLP
RCD Technology Inc.
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