Radio frequency identification (RFID) tag lamination process...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S119000, C343S760000

Reexamination Certificate

active

07456506

ABSTRACT:
A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

REFERENCES:
patent: 3759246 (1973-09-01), Flack et al.
patent: 5058161 (1991-10-01), Weiss
patent: 5463377 (1995-10-01), Kronberg
patent: 5598032 (1997-01-01), Fidalgo
patent: 5629981 (1997-05-01), Nerlikar
patent: 5786626 (1998-07-01), Brady et al.
patent: 5874902 (1999-02-01), Heinrich et al.
patent: 5892611 (1999-04-01), Iisuka
patent: 5942978 (1999-08-01), Shafer
patent: 5963134 (1999-10-01), Bowers et al.
patent: 6049461 (2000-04-01), Haghiri-Tehrani et al.
patent: 6089284 (2000-07-01), Kaehler et al.
patent: 6111520 (2000-08-01), Allen et al.
patent: 6130623 (2000-10-01), MacLellan et al.
patent: 6133833 (2000-10-01), Sidlauskas et al.
patent: 6147662 (2000-11-01), Grabau et al.
patent: 6204760 (2001-03-01), Brunius
patent: 6206292 (2001-03-01), Robertz et al.
patent: 6265977 (2001-07-01), Vega et al.
patent: 6400323 (2002-06-01), Yasukawa et al.
patent: 6421013 (2002-07-01), Chung
patent: 6514790 (2003-02-01), Plettner et al.
patent: 6696952 (2004-02-01), Zirbes
patent: 6774800 (2004-08-01), Friedman et al.
patent: 6849936 (2005-02-01), Berman et al.
patent: 2002/0053735 (2002-05-01), Neuhaus et al.
patent: 2002/0140608 (2002-10-01), Zaghloul et al.
patent: 2003/0116790 (2003-06-01), Kokuchi et al.
patent: 2004/0070510 (2004-04-01), Zhang et al.
patent: 2005/0128086 (2005-06-01), Brown et al.
patent: 2005/0252605 (2005-11-01), Green et al.
patent: 0 903 805 (1999-03-01), None
PCT International Search Report dated Apr. 29, 2008 in connection with Application No. PCT/US06/60922.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Radio frequency identification (RFID) tag lamination process... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radio frequency identification (RFID) tag lamination process..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radio frequency identification (RFID) tag lamination process... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4042836

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.