Reduced-dimension microelectronic component assemblies with...

Details Reduced-dimension microelectronic component assemblies with... Reduced-dimension microelectronic component assemblies with...

2006-08-22

2006-08-22

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S692000, C257S730000, C257S786000

Reexamination Certificate

active

07095122

ABSTRACT:
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component mounted to a substrate. The substrate carries a plurality of bond pads at a location substantially coplanar with a terminal surface of the microelectronic component. This enables a smaller package to be produced by moving the bond pads laterally inwardly toward the periphery of the microelectronic component.

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