Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2009-11-10
2011-12-27
Clark, Sheila V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S780000
Reexamination Certificate
active
08084871
ABSTRACT:
An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
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PCT: International Search Report and Written Opinion of the International Searching Authority for PCT/US2010/056116 (counterpart application); Jun. 27, 2011; 11 pages.
Khandekar Viren
Rahim S. Kaysar
Samoilov Arkadii
Xu Yong Li
Zhou Tiao
Clark Sheila V
Howison & Arnott , L.L.P.
Maxim Integrated Products Inc.
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