Corporate Assignee
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Corporate Assignee
active
No affiliations
Chip scale power converter package having an inductor substrate
Circuit and method for controlling the secondary FET of...
Compact power semiconductor package and method with stacked...
Configuration of high-voltage semiconductor power device to...
Gold/silicon eutectic die bonding method
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