Chip scale power converter package having an inductor substrate

Details Chip scale power converter package having an inductor substrate Chip scale power converter package having an inductor substrate

2007-03-27

2011-11-15

Donovan, Lincoln (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

C336S232000, C361S760000, C029S602100

Reexamination Certificate

active

08058960

ABSTRACT:
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.

REFERENCES:
patent: 5747870 (1998-05-01), Pedder
patent: 5802702 (1998-09-01), Fleming et al.
patent: 5909050 (1999-06-01), Furey et al.
patent: 6031445 (2000-02-01), Marty et al.
patent: 6441715 (2002-08-01), Johnson
patent: 7068138 (2006-06-01), Edelstein et al.
patent: 7355282 (2008-04-01), Lin et al.
patent: 2004/0208032 (2004-10-01), Edo et al.
patent: 2005/0146018 (2005-07-01), Jang et al.
patent: 2005/0146411 (2005-07-01), Gardner
patent: 2005/0184357 (2005-08-01), Chiba
patent: 2005/0263847 (2005-12-01), Anzai et al.
patent: 2006/0039224 (2006-02-01), Lotfi et al.
patent: 2007/0090912 (2007-04-01), Lee
patent: 2173956 (1986-10-01), None
patent: 2002233140 (2002-08-01), None

Affiliated with

Also associated with

Rating

Chip scale power converter package having an inductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip scale power converter package having an inductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip scale power converter package having an inductor substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4258596