4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents
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ABB Industrie AG

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Abdo David F.

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Adishian Gary C.

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Advanced Packaging Concepts, Inc.

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Agatstein Louis W.

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Aihara Toshio

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Akiyama Hirosi

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Alcoe David James

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Alpha and Omega Semiconductor Incorporated

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Alves Francisco D.

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Amin Ahmed

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Andou Katsuji

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Arguelles Ronaldo M.

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Arlow Gregory A.

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Arvelo Amilcar R.

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Asat Ltd.

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Atio System, Inc.

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Azar Kaveh

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Babock James Wittman

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Baek Joong-hyun

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