Intermetal dielectric using HDP-CVD oxide and SACVD O3-TEOS
Intermetallic aluminides and silicides articles, such as...
Internal circuit structure of semiconductor chip with...
Internally reinforced bond pads
Interposer and method of making same
Interposer capacitor built on silicon wafer and joined to a...
Interposer for redistributing signals
Inverse integrated circuit fabrication process
Ion beam dual damascene process
Ion implantation combined with in situ or ex situ heat...
Ionized metal plasma (IMP) method for forming (111) oriented...
Ionized metal plasma deposition process having enhanced via...
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate...
Isolation dielectric deposition in multi-polysilicon chemical-me
Isolation dielectric deposition in multi-polysilicon...
Isolation regions and their formation
Isolation using an antireflective coating
Isolation using an antireflective coating
Isolation using an antireflective coating