Brazed leaded package

Details Brazed leaded package Brazed leaded package

1988-03-30

1989-04-04

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 2310

Patent

active

048188212

ABSTRACT:
A brazed leaded package is provided having buried brazed areas thereby eliminating the need of subsequent protective plating of the brazed areas. The package has a heat conductive support which supports a plurality of leads. The distal end of the leads terminate on the top of the heat conductive support in a braze pad to which are brazed formed leads for providing interface connection to a semiconductor integrated circuit contained within the package. The package can be sealed by using a solid ceramic cover having a glazed glass on its bottom side which is heated up to reflow and provide the seal.

REFERENCES:
patent: 4038488 (1977-07-01), Lin
patent: 4331258 (1982-05-01), Geschwind
patent: 4633573 (1987-01-01), Scherer
TRW AD, Electronic Business, p. 31 Mar. 1, 1988.

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