Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1986-04-29
1989-03-21
Tarcza, Thomas H.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 71, H02G 1308
Patent
active
048148555
ABSTRACT:
Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modification of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape arrangement to the Inner Lead Bonds of the area tape.
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Hodgson Rodney T.
Jones Harry J.
Ledermann Peter G.
Moskowitz Paul A.
Reiley Timothy C.
International Business Machines - Corporation
Jones II Graham S.
Morris Daniel P.
Sotomayor John B.
Tarcza Thomas H.
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