Bump chip lead frame and package

Details Bump chip lead frame and package Bump chip lead frame and package

2005-03-08

2005-03-08

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C257S676000, C257S738000, C257S778000

Reexamination Certificate

active

06864423

ABSTRACT:
A lead frame with a plurality of bump terminals is provided. Stamping an indentation into each lead in the lead frame forms the bump terminals. The bump terminals will be used as contact points in a completed semiconductor device.

REFERENCES:
patent: 6018189 (2000-01-01), Mizuno
patent: 6191494 (2001-02-01), Ooyama et al.
patent: 6198171 (2001-03-01), Huang et al.
patent: 6376921 (2002-04-01), Yoneda et al.

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