Integrated circuit package with lead fingers extending into...
Integrated circuit package with low inductance ground path...
Integrated circuit package with overlapped die on a common lead
Integrated circuit package-on-package stacking system
Integrated circuit packages with interconnects on top and...
Interdigitated capacitor design for integrated circuit lead...
Interdigitated capacitor design for integrated circuit lead...
Interdigitated capacitor design for integrated circuit lead...
Interdigitated capacitor design for integrated circuit lead...
Interdigitated capacitor design for integrated circuit leadframe
Interdigitated leads-over-chip lead frame and device for...
Interdigitated leads-over-chip lead frame, device, and...
Interdigitated leads-over-chip lead frame, device, and...
Intergrated circuit packaging with improved die bonding
Interposer configured to reduce the profiles of...
Interposer for separating stacked semiconductor chips...