Intergrated circuit packaging with improved die bonding

Details Intergrated circuit packaging with improved die bonding Intergrated circuit packaging with improved die bonding

2008-07-02

2010-11-23

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23040, C257SE21510, C257S773000, C257S774000, C257S775000, C257S776000, C257S668000, C257S666000, C257S670000, C257S672000

Reexamination Certificate

active

07838974

ABSTRACT:
Particular embodiments of the present invention provide a leadframe suitable for use in packaging IC dice that enables stress reduction in and around the die, die attach material, die attach pad and mold interfaces. More particularly, various leadframes are described that include recesses in selected regions of the top surface of the die attach pad.

REFERENCES:
patent: 6686652 (2004-02-01), Bayan et al.
patent: 7205180 (2007-04-01), Sirinorakul et al.
patent: 7227245 (2007-06-01), Bayan et al.
patent: 2001/0007780 (2001-07-01), Minamio et al.
patent: 2003/0006055 (2003-01-01), Chien-Hung et al.
patent: 2005/0167855 (2005-08-01), Minamio et al.
patent: 2005/0263861 (2005-12-01), Ahn et al.
patent: 2006/0001136 (2006-01-01), Tao et al.
patent: 2006/0255438 (2006-11-01), Omori et al.
patent: 2007/0075404 (2007-04-01), Dimaano et al.
patent: 2007/0178630 (2007-08-01), Huang
patent: 2007/0215990 (2007-09-01), San Antonio et al.
patent: 2008/0079127 (2008-04-01), Gerber
patent: 2009/0230521 (2009-09-01), Zhang et al.

Affiliated with

Also associated with

Rating

Intergrated circuit packaging with improved die bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Intergrated circuit packaging with improved die bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Intergrated circuit packaging with improved die bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4240600