Interdigitated capacitor design for integrated circuit leadframe

Details Interdigitated capacitor design for integrated circuit leadframe Interdigitated capacitor design for integrated circuit leadframe

1998-04-01

2000-09-05

Clark, Shelia V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257123, H01L 23495

Patent

active

061147567

ABSTRACT:
A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated capacitor may be placed as a LOC type lead frame member between electrical bond pads on the die. The capacitor sections comprise Vcc and Vss bus bars.

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"Three Metal Layer QFP (TM QFP)", Publication of Shinko Electric Industries Co., Ltd. (2 pages).

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