4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With separate tie bar element or plural tie bars
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Leadframe with die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leadframe with pedestal

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent

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Leadframe, plastic-encapsulated semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leadframe-based chip scale semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leadless leadframe with an improved die pad for mold locking

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leads under chip IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Low inductance lead frame for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent

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