Leadframe with die pad

Details Leadframe with die pad Leadframe with die pad

2007-07-10

2007-07-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S666000, C257S674000, C257SE23031, C257SE23037, C257SE23047

Reexamination Certificate

active

11076951

ABSTRACT:
A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.

REFERENCES:
patent: 4791472 (1988-12-01), Okikawa et al.
patent: 6072228 (2000-06-01), Hinkle et al.
patent: 6437427 (2002-08-01), Choi
patent: 6501156 (2002-12-01), Nakanishi et al.
patent: 2002/0140064 (2002-10-01), Wu et al.
patent: 424313 (2001-03-01), None

Affiliated with

Also associated with

Rating

Leadframe with die pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe with die pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe with die pad will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3816290