Leadframe with pedestal

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Patent

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Details

257673, 257676, H01L 2348

Patent

active

054790506

ABSTRACT:
A raised pedestal is formed on a leadframe die mount pad and is used in forming an electrical connection between the die bond pad and the semiconductor die, the electrical connection being isolated from the shear forces developed during temperature cycling or during thermal shock of the resultant semiconductor device. Such shear forces usually result in destruction of the bond between the semiconductor die and the die bond pad.

REFERENCES:
patent: 4486945 (1984-12-01), Aigoo
patent: 4649415 (1987-03-01), Hebert
patent: 4903114 (1990-02-01), Aoki et al.

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