4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Entirely of metal except for feedthrough
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Structure for mounting electronic components and method for moun

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Thermally responsive compressive diode assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Thin and heat radiant semiconductor package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Use of a reference fiducial on a semiconductor package to...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Using a thermal barrier to provide a hermetic seal surface on al

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Wafer assembly comprising MEMS wafer with polymerized...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Wafer level package including a device wafer integrated with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Wafer-level package with a cavity and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Waferscale package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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