4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Entirely of metal except for feedthrough
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Metal substrate having an IC chip and carrier mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Metallic electronic component packaging arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Method for attaching shields on substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Micro-electro-mechanical system (MEMS) package having metal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Micro-electro-mechanical system (MEMS) package having metal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Micro-electro-mechanical system (MEMS) package having side...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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Mount for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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Multi-layer device and method for producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate

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