Waferscale package system

Details Waferscale package system Waferscale package system

2006-02-02

2008-08-19

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S704000

Reexamination Certificate

active

07414310

ABSTRACT:
A waferscale package system is provided forming a protection structure comprises forming a wafer, fabricating a device element on the wafer, forming a waferscale spacer around the device element, and attaching a waferscale cap to the waferscale spacer to cover the device element, attaching a carrier to the protection structure, and molding an encapsulant around the protection structure to the carrier.

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