Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent
1996-10-31
1999-03-02
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
257687, 257709, 257717, 361728, 361756, H01L 23043
Patent
active
058775536
ABSTRACT:
In a packaging arrangement suitable for semiconductor devices, a semiconductor chip is mounted on a surface of an aluminum base with a bonding layer interposed therebetween. The aluminum base has a capability to favorably dissipate heat from the semiconductor chip. The bonding layer consists of a resilient and heat conductive material such as silicone resin mixed with silver powder so that thermal strain of the metal base is accommodated by the resiliency of the bonding layer, and is prevented from adversely affecting the electronic component chip even though the aluminum base demonstrates a substantially more significant thermal expansion than the semiconductor chip. It is therefore possible to achieve a high reliability in the packaging of semiconductor devices at a minimum cost.
REFERENCES:
patent: 4314270 (1982-02-01), Iwatani
patent: 4381469 (1983-04-01), Ogawa et al.
patent: 4577056 (1986-03-01), Butt
patent: 4663649 (1987-05-01), Suzuki et al.
patent: 5023398 (1991-06-01), Mahulikar et al.
patent: 5317194 (1994-05-01), Sako
patent: 5344498 (1994-09-01), Inoue
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5552637 (1996-09-01), Yamagata
patent: 5641997 (1997-06-01), Ohta et al.
Ishikawa Koji
Nakayama Osamu
MacDonald Thomas S.
NHK Spring Co. Ltd.
Ostrowski David
LandOfFree
Metallic electronic component packaging arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Metallic electronic component packaging arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallic electronic component packaging arrangement will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-425540