Micro-electro-mechanical system (MEMS) package having metal...

Details Micro-electro-mechanical system (MEMS) package having metal... Micro-electro-mechanical system (MEMS) package having metal...

2008-05-06

2008-05-06

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S704000, C257SE23128

Reexamination Certificate

active

11180308

ABSTRACT:
A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid to the metal layer; providing a side sealing member on a side surface of the substrate; and covering the lid and the substrate with a metal sealing member, thus hermetically sealing the MEMS element from the external environment.

REFERENCES:
patent: 6303986 (2001-10-01), Shook
patent: 7078804 (2006-07-01), Hong et al.
patent: 7102224 (2006-09-01), Pahl

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