Micro-electro-mechanical system (MEMS) package having side...

Details Micro-electro-mechanical system (MEMS) package having side... Micro-electro-mechanical system (MEMS) package having side...

2005-07-12

2008-10-28

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S433000, C257S434000, C257S704000, C257SE23127, C257SE23193

Reexamination Certificate

active

07443024

ABSTRACT:
A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment. The MEMS package includes a base substrate, with an MEMS element provided on a surface of the base substrate; a lid glass joined to the base substrate such that the lid glass covers the MEMS element and transmits incident light; a dam sealing member provided on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment; and a second sealing member deposited on an upper surface of the dam sealing member such that the second sealing member is provided on the surface of the base substrate and the side surface of the lid glass, thus secondarily hermetically sealing the MEMS element from the external environment.

REFERENCES:
patent: 5641984 (1997-06-01), Aftergut et al.
patent: 6303986 (2001-10-01), Shook
patent: 2003/0143423 (2003-07-01), McCormick et al.
patent: 2005/0202591 (2005-09-01), Chen et al.

Affiliated with

Also associated with

Rating

Micro-electro-mechanical system (MEMS) package having side... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-electro-mechanical system (MEMS) package having side..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-electro-mechanical system (MEMS) package having side... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3991186