Mount for semiconductor device

Details Mount for semiconductor device Mount for semiconductor device

1997-08-11

2000-10-24

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

257697, 257731, H01L 2312, H01L 2348

Patent

active

06137170&

ABSTRACT:
A semiconductor device includes a semiconductor pellet (1), and a package having a pellet mount portion (21) on which a semiconductor pellet (1) is mounted. The semiconductor pellet (1) is mounted on the pellet mount portion (21) of the package through a joint material (6). The area of the surface of the pellet mount portion (21) on which the semiconductor pellet (1) is mounted is set to be smaller than the area of the surface of the semiconductor pellet (1) which is mounted on the pellet mount portion (21), thereby preventing the climb-up of the joint material (6) along the side surface of the semiconductor pellet (1).

REFERENCES:
patent: 5315155 (1994-05-01), O'Donnelly et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5650662 (1997-07-01), Edwards et al.

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