Method for attaching shields on substrates

Details Method for attaching shields on substrates Method for attaching shields on substrates

2006-11-07

2006-11-07

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257SE23183, C257SE23193

Reexamination Certificate

active

07132745

ABSTRACT:
A method (100) of attaching a shield (52or82) to a substrate (40) can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern (26), applying (101) solder to the metallized trace pattern, and optionally placing (103) components (22and27) on portions of the metallized trace pattern. The method can further include the steps of reflowing (104) the solder to form a selective cladded trace pattern (32or62) on a portion of the metallized trace pattern reserved for the shield, placing (108) the shield on the cladded trace pattern, and reflowing (109) the substrate.

REFERENCES:
patent: 5167361 (1992-12-01), Liebman et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5411199 (1995-05-01), Suppelsa et al.
patent: 5620927 (1997-04-01), Lee
patent: 5945735 (1999-08-01), Economikos et al.

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