Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2006-11-07
2006-11-07
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C257SE23183, C257SE23193
Reexamination Certificate
active
07132745
ABSTRACT:
A method (100) of attaching a shield (52or82) to a substrate (40) can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern (26), applying (101) solder to the metallized trace pattern, and optionally placing (103) components (22and27) on portions of the metallized trace pattern. The method can further include the steps of reflowing (104) the solder to form a selective cladded trace pattern (32or62) on a portion of the metallized trace pattern reserved for the shield, placing (108) the shield on the cladded trace pattern, and reflowing (109) the substrate.
REFERENCES:
patent: 5167361 (1992-12-01), Liebman et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5411199 (1995-05-01), Suppelsa et al.
patent: 5620927 (1997-04-01), Lee
patent: 5945735 (1999-08-01), Economikos et al.
Motorola Inc.
Pert Evan
Sandvik Benjamin P.
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