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Plastic-packaged semiconductor device having a heat sink matched

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Plate and column type semiconductor package having heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Polymer encapsulated electrical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Polymer encapsulated electrical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Potted hybrid integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Power control device with semiconductor chips mounted on a...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Pre-bond encapsulation of area array terminated chip and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Preparation method of underfill for flip chip package and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Printed circuit board and chip-on-board packages using same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Protective envelope for a semiconductor integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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