Plastic-packaged semiconductor device having a heat sink matched
Plate and column type semiconductor package having heat sink
Polymer encapsulated electrical devices
Polymer encapsulated electrical devices
Potted hybrid integrated circuit
Power control device with semiconductor chips mounted on a...
Pre-bond encapsulation of area array terminated chip and...
Preparation method of underfill for flip chip package and...
Printed circuit board and chip-on-board packages using same
Protective envelope for a semiconductor integrated circuit