Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Integrated circuit package system with adhesive restraint
Integrated circuit package system with different mold...
Integrated circuit package system with dual connectivity
Integrated circuit package system with ground bonds
Integrated circuit package system with heat sink
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Profile ID: LFUS-PAI-P-2170324