Integrated circuit package system with ground bonds

Details Integrated circuit package system with ground bonds Integrated circuit package system with ground bonds

2007-06-21

2011-11-22

Im, Junghwa M (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S692000, C257S690000, C257S666000, C257S670000, C257SE23037

Reexamination Certificate

active

08062934

ABSTRACT:
An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.

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