Integrated circuit package system with different mold...

Details Integrated circuit package system with different mold... Integrated circuit package system with different mold...

2007-05-16

2011-10-18

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000, C257S667000, C257S690000, C257S696000, C257S773000, C257S775000

Reexamination Certificate

active

08039947

ABSTRACT:
An integrated circuit package system is provided including forming a first inner lead having a first inner bottom side and a first outer lead, forming a first side lock of the first inner lead above the first inner bottom side, connecting an integrated circuit die with the first inner lead and the first outer lead, and encapsulating the integrated circuit die and the first side lock.

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