Integrated circuit package system with adhesive restraint

Details Integrated circuit package system with adhesive restraint Integrated circuit package system with adhesive restraint

2007-09-25

2007-09-25

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S670000, C257S674000, C257SE23037, C257SE23039

Reexamination Certificate

active

11162682

ABSTRACT:
An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad.

REFERENCES:
patent: 5506425 (1996-04-01), Whtiney et al.
patent: 6166430 (2000-12-01), Yamaguchi
patent: 6433424 (2002-08-01), Sammon
patent: 6870245 (2005-03-01), Schatzler et al.
patent: 2002/0031869 (2002-03-01), Minamio et al.
patent: 2002/0121680 (2002-09-01), Ahn et al.
patent: 2002/0195703 (2002-12-01), Kameda
patent: 2003/0001244 (2003-01-01), Araki et al.
patent: 2003/0001260 (2003-01-01), Azuma
patent: 2004/0056337 (2004-03-01), Hasebe et al.

Affiliated with

Also associated with

Rating

Integrated circuit package system with adhesive restraint does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package system with adhesive restraint, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package system with adhesive restraint will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3757591