4. Optics: measuring and testing
  5. By light interference
  6. For dimensional measurement

Yao-Ting Huang

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Leadframe for a multi-chip package and method for...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Leadframe of a leadless flip-chip package and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Leadframe of a leadless flip-chip package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadframe with a chip pad for two-sided stacking and method...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Leadless semiconductor package and method for manufacturing...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Profile ID: LFUS-PAI-P-2274028

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