4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Vage Oganesian

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Edge connect wafer level stacking

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Methods and apparatus for packaging integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Methods and apparatus for packaging integrated circuit devices

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Methods and apparatus for packaging integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Methods and apparatus for packaging integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2318896

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