Methods and apparatus for packaging integrated circuit devices

Details Methods and apparatus for packaging integrated circuit devices Methods and apparatus for packaging integrated circuit devices

2007-09-04

2007-09-04

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S684000, C257S690000, C438S106000, C438S107000, C438S113000

Reexamination Certificate

active

11125624

ABSTRACT:
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.

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